AMD invests over $10 billion in Taiwan to boost AI infrastructure and advanced packaging

AMD announced an investment of over $10 billion in Taiwan to strengthen strategic partnerships and boost advanced packaging capabilities, accelerating AI infrastructure development. This investment will drive progress in advanced chip manufacturing, packaging, and production technologies.

AMD will collaborate with partners like ASE and SPIL to develop next-generation 2.5D bridge interconnect technology for wafers, enabling high-bandwidth connections for more efficient AI systems. Later this year, AMD plans to deploy its Helios rack-scale platform, featuring Instinct MI450X GPUs and 6th-gen EPYC processors, aiming to push AI performance to new heights.