Enflame and Advanced Packaging unveil glass-based chip packaging sample

Enflame and Advanced Packaging unveiled China's first glass-based CoPoS advanced packaging sample for AI chips at WAIC 2026. It's the first time Enflame's high-end AI chip uses domestic CoPoS packaging tech.

The sample combines glass substrate, PVD, panel-level lithography, and precision plating. Glass substrates offer better heat dissipation and signal transmission, boosting AI chip performance.