OrientSoc unveils world's first software-defined 3D AI chip DF1000

At the 2026 World AI Conference in Shanghai, OrientSoc debuted the world's first software-defined 3D AI chip, DF1000, winning the SAIL award. Built with a fully domestic supply chain and 3D hybrid bonding for wafer-level stacking, it delivers 520 TFLOPS.

The DF1000 uses software-defined tech to decouple hardware and software, achieving 520 TFLOPS@BF16 on a 14nm process, boosting memory bandwidth and reducing supply chain risks. Founded in 2024 in Shanghai Zhangjiang, OrientSoc has over 500 staff, focusing on high-performance AI chips and a self-owned ecosystem.