Samsung and Broadcom sign $200 billion deal for AI chips

Samsung and Broadcom signed a deal at an AI summit in San Francisco. They plan to work together on memory chips and chip manufacturing until 2030. The partnership could be worth over $200 billion.

For memory, Samsung will provide high-performance storage like HBM for Broadcom's next AI chips. For manufacturing, Samsung will make Broadcom's wireless chips using its 2nm technology and advanced packaging to boost performance.

Samsung's CEO said AI is creating huge demand for advanced chips. By working with Broadcom, they hope to build better AI infrastructure for the future.