Suiyuan Tech unveils new AI super node and chip packaging tech

At the 2026 World AI Conference, Suiyuan Tech launched three products, including the YunSui ESL64-O super node, CoPoS+ AI chip, and SkyBase computing platform. The super node, co-developed with ZTE, uses self-designed AI chips and a cable-free OEX design to lower costs and speed up production. Suiyuan also showed its first CoPoS panel-level packaging sample for AI chips, offering better thermal stability and signal quality. The company has received approval for a Shanghai stock market IPO, aiming to raise 6 billion yuan for next-gen AI chip projects.