Baidu's Kunlun M100 Chip Makes First Public Appearance at WAIC 2026

At the 2026 World AI Conference (WAIC) in Shanghai, Baidu's Kunlun Chip technology showed its fourth-gen AI chip, the M100, in public for the first time. It's built for large language model reasoning, using their own XPU design, and focuses on being general, efficient, and affordable. This offers a new option for AI computing.

Kunlun displayed a full lineup of products at the conference, including chips, accelerator cards, servers, and supernode systems. The 32/64-card supernode and 256-card supernode cluster were highlights—they are among the first supernode products in China to be mass-produced and delivered.

The M100 and M300 chips were announced in November 2025. The M100 is optimized for large-scale reasoning with a focus on "extreme cost-effectiveness," while the M300 targets training and reasoning for ultra-large multimodal models, aiming for "extreme performance."