Frore Systems Launches LiquidJet Diamond, a Diamond-Based Cooling Plate for AI Chips

As AI chips draw more power, keeping them cool has become a key challenge, and demand for advanced liquid cooling keeps growing.

US cooling company Frore Systems has launched LiquidJet Diamond. Built on its LiquidJet 3D cold plate, it adds a vapor chamber layer with an integrated diamond wafer, covering chip hotspots with precision.

The company says the new plate can cool extreme hotspots with a power density of up to 770 W/cm². Compared with the previous version, it cuts GPU hotspot temperature by 10°C and improves token energy efficiency by 10%. Diamond's high heat conductivity makes it a strong fit for high-power chips.

This solution could support next-generation AI chips and help data centers boost computing density and energy efficiency.