Houmo AI Confirms Next-Gen Edge AI Chip Will Use 3D CIM Architecture, Doubling Computing Power in the Same Area

At the 2026 Global AI Chip Summit, Chinese chip company Houmo AI confirmed that its next-generation edge AI chip for large models will use a 3D CIM compute-in-memory architecture, combining compute-in-memory with 3D DRAM technology. The chip will enable real-time thinking and interaction on edge devices. Through vertical stacking, it can deliver twice the computing power in the same area, while potentially reducing power consumption and heat.

Houmo AI released the Houmo Manjie M50 chip in July 2025. It has a typical power consumption of 10W and offers 160TOPS (INT8) or 100TFLOPS (bFP16) computing power, with 48GB memory capacity and 153.6GB/s memory bandwidth. The chip has already been adopted in over 150 products across various application scenarios.

The new flagship chip's architectural upgrade means edge AI devices can achieve higher computing density in limited space, while reducing power and heat burdens, providing a hardware foundation for deploying large models on edge devices.