JetCool to Provide Direct Liquid Cooling Solutions for Broadcom's Next-Gen AI XPU

JetCool, a data center cooling technology firm under Flex (a leading EMS provider), recently announced a partnership with Broadcom to supply liquid cooling solutions for Broadcom's next-generation AI XPU. The collaboration was revealed on the 11th of this month local time in the US.

JetCool's single-phase chip-level direct liquid cooling solution can seamlessly integrate with Broadcom's server mechanical and thermal reference designs, supporting the next-gen AI XPU's heat density of up to 4 W/mm² and total power consumption of several kilowatts.