Tesla Unveils AI Chip Roadmap: AI5 Offers 5x Higher Computing Power, AI6 to Use 2nm Process

Tesla CEO Elon Musk shared the company's future plans for self-developed AI chips after the tape-out of the AI5 chip. He noted that a single AI5 chip's effective computing power is 5 times that of the dual AI4 chip solution, marking a significant performance boost.

The upcoming AI6 chip will be manufactured by Samsung Electronics at its Taylor, Texas wafer fab using a 2nm process, equipped with LPDDR6 memory. It will double performance in a similar area (over 400mm²). The AI6.5 chip will be produced by TSMC Arizona (TSMC's U.S. subsidiary) using a 2nm process to further enhance performance. Both chips will have nearly half of their TRIP AI computing accelerators tightly integrated with SRAM, significantly improving effective bandwidth.

Notably, the memory chips packaged on both sides of the AI5 chip have obvious length-width differences, which do not match GDDR series characteristics and are likely to use LPDDR5X; the upgrade to LPDDR6 for AI6 is also expected.